Assembly Lines
Printed Circuit Board assembly is referred to as PCB assembly. It is the technique of assembling printed circuit boards with electronic components to produce working electronic devices.
SMT (Surface Mount Technology): Components are soldered directly onto the PCB surface, offering miniaturization and higher assembly density.
THT (Through-Hole Technology): Component leads are inserted through holes in the PCB and soldered on the opposite side, providing mechanical strength for robust applications.
BGA (Ball Grid Array): A type of SMT package with numerous solder balls on the bottom for electrical connection, often used for high-pin-count integrated circuits.
Hybrid assembly lines: Combine SMT and THT processes on a single production line to cater to products requiring both technologies for optimal functionality.
Utilizing cutting-edge Surface Mount Technology (SMT), our PCB assembly lines ensure high-speed and precise placement of surface mount components, guaranteeing optimal performance and reliability. Complementing this, our assembly lines are equipped for Through-Hole assembly processes, providing versatility to handle diverse components and accommodate various design requirements. Our commitment to quality control is fortified with Automated Optical Inspection (AOI) systems for real-time visual inspections, identifying defects and ensuring adherence to specified standards. Additionally, we employ In-Circuit Testing (ICT) to meticulously test each PCB assembly, detecting faults and verifying electrical performance to ensure functionality and integrity.
With extensive experience in electronic manufacturing, Indic EMS Electronics offers versatile PCB assembly lines capable of handling diverse requirements, from prototypes to large-scale production. Our teams customize assembly processes to accommodate the unique needs of each project, whether it involves a complex, high-density board or a simpler design. We provide comprehensive end-to-end solutions, encompassing design, prototyping, full-scale production, and rigorous testing.
Solder flux is a chemical cleaning agent applied before soldering to remove oxides from metal surfaces, promoting better wetting and flow of the solder, and preventing re-oxidation during the soldering process.
Lead-Free Solder: Environmental friendly, commonly tin-copper or tin-silver-copper. Leaded Solder: Contains tin and lead, known for ease of use but less environmentally friendly. Silver Solder: Higher melting point, used for stronger joints.
Manual Soldering: For prototypes or repairs. Reflow Soldering: For surface-mount components. Wave Soldering: For through-hole and bulk components.
Clean the surfaces to be soldered. Apply flux to remove oxides and improve wetting. Heat the joint with a soldering iron. Apply solder directly to the joint, not the iron tip. Remove the iron and allow the joint to cool naturally.
Solder is typically made from a mixture of metals. Traditional solder contains lead (Pb) and tin (Sn), while lead-free solder, which is becoming standard, primarily consists of tin, with additives like copper, silver, and sometimes bismuth.
Solder creates a secure and conductive connection between electronic components and the PCB, ensuring the circuit functions as intended by facilitating electrical continuity.
Manual Soldering: Using a soldering iron for individual components. Reflow Soldering: Applying solder paste and heating the entire board to melt the paste, used for SMT components. Wave Soldering: Passing the PCB over a wave of molten solder, primarily for through-hole components.
The most commonly used solder in PCB assembly is a lead-free alloy, typically composed of tin (Sn), copper (Cu), and sometimes silver (Ag), in compliance with environmental regulations like RoHS.
PCB soldering is the process of joining electronic components to a printed circuit board (PCB) using solder, a fusible metal alloy, to establish a strong electrical connection between the component leads and the board's conductive pathways.
Choosing the right stencil thickness depends on: The size and pitch of components: Finer pitches require thinner stencils. The volume of solder paste needed: Larger pads may require thicker stencils.