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Major soldering defects include cold joints, dry joints, solder bridges, tombstoning, solder balls, and voids, each affecting the functionality and reliability of the PCB.

An in-circuit test (ICT) is a method of electrical testing that checks the components mounted on a PCB individually for shorts, opens.

PFMEA, or Process Failure Mode and Effects Analysis, is a structured approach to identify, prioritize, and mitigate risks in a manufacturing process, aiming to improve quality and reliability by preventing process-related failures.

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

PCBs are shipped in protective packaging, including anti-static bags and cushioning materials, within sturdy boxes. This ensures protection against physical damage, electrostatic discharge, and moisture during transit.

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.

Designing a test involves first identifying its objectives and requirements, then selecting suitable methods and tools. It requires creating detailed test cases and procedures to cover all functionalities and failure modes, and integrating testing checkpoints into the product design for efficient access and evaluation.

Small volume PCB refers to the production of PCBs in limited quantities, typically for prototyping, custom projects, or initial market releases. This approach allows for detailed attention to quality, design iteration, and testing.

The Bill of Materials (BOM) in box build assembly is a comprehensive list detailing every part and component required for the assembly, including quantities, specifications, and supplier information. It serves as a critical resource for planning, purchasing, and assembling the final product.

Using a PFMEA involves mapping out each step of the manufacturing process, identifying potential failure modes, assessing their impact and likelihood, prioritizing them based on risk, and implementing control measures to mitigate or eliminate these risks.