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Automated machinery for fast, consistent tasks. Manual workstations for complex or delicate operations. Material handling systems like conveyors or robots. Quality control stations for ensuring product standards.

A hybrid assembly system combines automated and manual assembly processes within a single production line. This system leverages the precision and speed of automation while retaining the flexibility and problem-solving capabilities of human workers.

A BGA package is a type of surface mount packaging for integrated circuits that uses a grid of solder balls as its connectors. These solder balls provide the electrical connections to the PCB, enabling a compact and high-density connection layout.

The SMT (Surface Mount Technology) assembly process involves placing and soldering surface mount components onto a PCB. It's characterized by the use of automated machines for precise component placement and reflow soldering.

The word "turnkey" refers to a product or service that is delivered in a state ready for immediate use by the purchaser. It originates from the concept of being able to turn the key in a newly acquired property and start using it right away, without needing to undertake any additional setup or installation.

Product packaging design is crucial because it serves as the first point of interaction with the consumer, significantly influencing purchasing decisions. It protects the product, communicates brand values, differentiates the product in the market, and enhances the customer experience.

We need Design for Test to ensure products can be tested efficiently and thoroughly for quality and performance, reducing testing time and costs, improving product reliability, and facilitating early detection of defects.

Design for Test (DFT) is a concept that involves designing products in a way that makes them easier to test for defects and functionality. It integrates testability features into the product design to facilitate efficient and effective testing processes.

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

MDA (Manufacturing Defects Analyzer) is used in the PCB manufacturing process to detect defects like shorts, opens, and missing components. It ensures boards are defect-free before moving to more complex assembly stages.