Frequently Asked
Questions

Partial turnkey PCB assembly involves the customer supplying some components, with the service provider managing the rest, including assembly and delivery. Full turnkey PCB assembly sees the service provider handling everything from component sourcing to assembly, requiring only the customer's design files for fully assembled PCB delivery.

SMT is used for attaching electronic components to a printed circuit board (PCB), allowing for more components to be mounted on both sides of the board, thus reducing size and improving electrical performance.

SMT components are electronic parts designed to be mounted directly onto the surface of PCBs without through-hole leads. They are smaller than traditional components, allowing for higher density and smaller PCB designs.

An SMT operator oversees the SMT assembly line, ensuring machines are set up correctly, monitoring the assembly process, making adjustments as needed, and inspecting finished PCBs for quality.

An SMT line works by sequentially processing PCBs through stages: applying solder paste, placing components with pick-and-place machines, reflow soldering to secure components, and inspecting the assembled board.

Industries that benefit most from hybrid assembly lines include: Automotive manufacturing Electronics and consumer goods Aerospace Medical devices

The minimum size for a PCB is dictated by the manufacturer's capabilities and the specifics of the design. However, PCBs can be made very small, with some being just a few millimeters in dimension for specialized applications.

In design, a stencil is a tool or template used to reproduce specific shapes, patterns, or letters on a surface, enabling consistent replication of the design.

To use a PCB stencil: Secure the stencil over the PCB. Apply solder paste over the stencil. Use a squeegee to spread the paste, filling the apertures. Carefully lift the stencil, leaving solder paste on the PCB pads. Proceed with component placement and reflow soldering.

Stencils are used in PCB assembly to ensure accurate, repeatable, and efficient application of solder paste, crucial for reliable soldering in surface mount technology processes.