Frequently Asked
Questions

Design for Test (DFT) is a concept that involves designing products in a way that makes them easier to test for defects and functionality. It integrates testability features into the product design to facilitate efficient and effective testing processes.

We need Design for Test to ensure products can be tested efficiently and thoroughly for quality and performance, reducing testing time and costs, improving product reliability, and facilitating early detection of defects.

Product packaging design is crucial because it serves as the first point of interaction with the consumer, significantly influencing purchasing decisions. It protects the product, communicates brand values, differentiates the product in the market, and enhances the customer experience.

The word "turnkey" refers to a product or service that is delivered in a state ready for immediate use by the purchaser. It originates from the concept of being able to turn the key in a newly acquired property and start using it right away, without needing to undertake any additional setup or installation.

The SMT (Surface Mount Technology) assembly process involves placing and soldering surface mount components onto a PCB. It's characterized by the use of automated machines for precise component placement and reflow soldering.

A BGA package is a type of surface mount packaging for integrated circuits that uses a grid of solder balls as its connectors. These solder balls provide the electrical connections to the PCB, enabling a compact and high-density connection layout.

Automated machinery for fast, consistent tasks. Manual workstations for complex or delicate operations. Material handling systems like conveyors or robots. Quality control stations for ensuring product standards.

Choosing low volume PCB assembly is best for: Rapid prototyping and development Custom or niche projects Reducing inventory risks and storage costs Gaining flexibility in responding to market demand or design adjustments

An SMT stencil is used to deposit solder paste on a PCB's surface mount pads before placing components. This ensures a consistent and precise amount of solder paste, critical for effective soldering in SMT processes.

A framework stencil PCB refers to a stencil that includes a surrounding frame, often made of aluminum, used to support and stretch the stencil material for consistent application across the entire PCB surface.