Frequently Asked
Questions

The most commonly used solder in PCB assembly is a lead-free alloy, typically composed of tin (Sn), copper (Cu), and sometimes silver (Ag), in compliance with environmental regulations like RoHS.

Functional testing can identify a wide range of defects, including: Incorrect component installation (wrong orientation or placement). Faulty components (damaged or non-operational parts). Soldering issues (cold joints, solder bridges). Missing components or incorrect component values. Short circuits or open circuits within the PCB.

An SMT stencil is used to deposit solder paste on a PCB's surface mount pads before placing components. This ensures a consistent and precise amount of solder paste, critical for effective soldering in SMT processes.

Automated machinery for fast, consistent tasks. Manual workstations for complex or delicate operations. Material handling systems like conveyors or robots. Quality control stations for ensuring product standards.

PCB shipping duration varies based on the shipping method, destination, and manufacturer's location. Standard shipping can take anywhere from a few days to several weeks, while expedited services can reduce this time significantly.

Product packaging design is crucial because it serves as the first point of interaction with the consumer, significantly influencing purchasing decisions. It protects the product, communicates brand values, differentiates the product in the market, and enhances the customer experience.

Manufacturing Defect Analysis involves identifying and analyzing defects in products to improve manufacturing processes and product quality, focusing on eliminating sources of failures.

We need Design for Test to ensure products can be tested efficiently and thoroughly for quality and performance, reducing testing time and costs, improving product reliability, and facilitating early detection of defects.

The SMT (Surface Mount Technology) assembly process involves placing and soldering surface mount components onto a PCB. It's characterized by the use of automated machines for precise component placement and reflow soldering.

Types of electrical testing include: Continuity Testing: Checks for open circuits. Insulation Resistance Testing: Measures the resistance between conductive parts and the ground or between two conductive parts. High Potential (Hi-Pot) Testing: Applies high voltage to ensure insulation integrity. Electrical Function Testing: Verifies the operational functionality of a device.