Frequently Asked
Questions

The most commonly used solder in PCB assembly is a lead-free alloy, typically composed of tin (Sn), copper (Cu), and sometimes silver (Ag), in compliance with environmental regulations like RoHS.

Functional testing can identify a wide range of defects, including: Incorrect component installation (wrong orientation or placement). Faulty components (damaged or non-operational parts). Soldering issues (cold joints, solder bridges). Missing components or incorrect component values. Short circuits or open circuits within the PCB.

Types of electrical testing include: Continuity Testing: Checks for open circuits. Insulation Resistance Testing: Measures the resistance between conductive parts and the ground or between two conductive parts. High Potential (Hi-Pot) Testing: Applies high voltage to ensure insulation integrity. Electrical Function Testing: Verifies the operational functionality of a device.

Electrical testing is crucial for: Ensuring the safety and reliability of electrical systems and components. Detecting manufacturing defects and preventing product failures. Complying with industry standards and regulations.

Manufacturing Defect Analysis involves identifying and analyzing defects in products to improve manufacturing processes and product quality, focusing on eliminating sources of failures.

A box build assembly can include the enclosure, all internal components (like PCBs, power supplies, displays), wiring and cable harnesses, firmware loading, functional testing, labeling, and packaging.

PCB shipping duration varies based on the shipping method, destination, and manufacturer's location. Standard shipping can take anywhere from a few days to several weeks, while expedited services can reduce this time significantly.

PCB reverse engineering involves deciphering the design of a printed circuit board (PCB) to understand its functionality and components without access to the original design documents.

The 17 common steps include design, material selection, pattern transfer, etching, layer lamination, drilling, plating, solder mask application, silkscreen, surface finishing, testing, inspection, depaneling, packaging, and shipping. This comprehensive process ensures PCB reliability and performance.

A product development strategy is a roadmap that outlines how a new product will be developed, launched, and managed to meet business objectives. It includes market analysis, product positioning, development timelines, and go-to-market plans.