Assembly Lines
Printed Circuit Board assembly is referred to as PCB assembly. It is the technique of assembling printed circuit boards with electronic components to produce working electronic devices.
SMT (Surface Mount Technology): Components are soldered directly onto the PCB surface, offering miniaturization and higher assembly density.
THT (Through-Hole Technology): Component leads are inserted through holes in the PCB and soldered on the opposite side, providing mechanical strength for robust applications.
BGA (Ball Grid Array): A type of SMT package with numerous solder balls on the bottom for electrical connection, often used for high-pin-count integrated circuits.
Hybrid assembly lines: Combine SMT and THT processes on a single production line to cater to products requiring both technologies for optimal functionality.
Utilizing cutting-edge Surface Mount Technology (SMT), our PCB assembly lines ensure high-speed and precise placement of surface mount components, guaranteeing optimal performance and reliability. Complementing this, our assembly lines are equipped for Through-Hole assembly processes, providing versatility to handle diverse components and accommodate various design requirements. Our commitment to quality control is fortified with Automated Optical Inspection (AOI) systems for real-time visual inspections, identifying defects and ensuring adherence to specified standards. Additionally, we employ In-Circuit Testing (ICT) to meticulously test each PCB assembly, detecting faults and verifying electrical performance to ensure functionality and integrity.
With extensive experience in electronic manufacturing, Indic EMS Electronics offers versatile PCB assembly lines capable of handling diverse requirements, from prototypes to large-scale production. Our teams customize assembly processes to accommodate the unique needs of each project, whether it involves a complex, high-density board or a simpler design. We provide comprehensive end-to-end solutions, encompassing design, prototyping, full-scale production, and rigorous testing.
The most commonly used solder in PCB assembly is a lead-free alloy, typically composed of tin (Sn), copper (Cu), and sometimes silver (Ag), in compliance with environmental regulations like RoHS.
A framework stencil PCB refers to a stencil that includes a surrounding frame, often made of aluminum, used to support and stretch the stencil material for consistent application across the entire PCB surface.
An SMT stencil is used to deposit solder paste on a PCB's surface mount pads before placing components. This ensures a consistent and precise amount of solder paste, critical for effective soldering in SMT processes.
Choosing low volume PCB assembly is best for: Rapid prototyping and development Custom or niche projects Reducing inventory risks and storage costs Gaining flexibility in responding to market demand or design adjustments
Automated machinery for fast, consistent tasks. Manual workstations for complex or delicate operations. Material handling systems like conveyors or robots. Quality control stations for ensuring product standards.
A BGA package is a type of surface mount packaging for integrated circuits that uses a grid of solder balls as its connectors. These solder balls provide the electrical connections to the PCB, enabling a compact and high-density connection layout.
The SMT (Surface Mount Technology) assembly process involves placing and soldering surface mount components onto a PCB. It's characterized by the use of automated machines for precise component placement and reflow soldering.
The word "turnkey" refers to a product or service that is delivered in a state ready for immediate use by the purchaser. It originates from the concept of being able to turn the key in a newly acquired property and start using it right away, without needing to undertake any additional setup or installation.
Solder is typically made from a mixture of metals. Traditional solder contains lead (Pb) and tin (Sn), while lead-free solder, which is becoming standard, primarily consists of tin, with additives like copper, silver, and sometimes bismuth.
Yes, for SMT assembly, a stencil is typically needed to apply solder paste evenly and accurately to the PCB, especially important for high-density or fine-pitch components to prevent soldering defects.