Frequently Asked
Questions

Low volume manufacturing involves producing small quantities of products, typically ranging from a few units to several thousand. It's ideal for prototypes, market testing, and custom or niche products.

Small volume PCB refers to the production of PCBs in limited quantities, typically for prototyping, custom projects, or initial market releases. This approach allows for detailed attention to quality, design iteration, and testing.

Functional testing is conducted by applying specific inputs to the PCB and measuring the outputs to compare against expected results. Test equipment may include signal generators, power supplies, and measurement devices, configured according to the PCB's operational specifications.

Turnkey assembly is a manufacturing service where the provider oversees the entire assembly process of a product, from sourcing materials and components to the final assembly, ensuring the product is ready for use or sale immediately upon delivery.

How does product development process work?

PFMEA (Process Failure Mode and Effects Analysis) is a systematic analytical tool used to identify and address potential failures in a manufacturing or assembly process. It's used by creating a step-by-step analysis for each process component, identifying potential failure modes, assessing their impact, and implementing mitigation strategies.

The Bill of Materials (BOM) in box build assembly is a comprehensive list detailing every part and component required for the assembly, including quantities, specifications, and supplier information. It serves as a critical resource for planning, purchasing, and assembling the final product.

PFMEA (Process FMEA) focuses specifically on identifying and reducing risks in manufacturing processes, while FMEA is a broader term that can refer to Design FMEA (DFMEA), Process FMEA (PFMEA), or System FMEA (SFMEA), each targeting different aspects of product and process reliability.

Simplify design for manufacturability. Choose common, cost-effective components. Conduct extensive testing to reduce revisions.

Cold/Dry Joints: Reheat the joint with proper solder and flux. Solder Bridges: Remove excess solder with desoldering braid. Solder Balls: Clean the area and reapply solder with correct temperature. Tombstoning: Adjust component placement and reflow solder. Voids: Apply additional flux and reheat to allow solder to fill gaps.