Frequently Asked
Questions

Tracking and tracing of shipments are facilitated by carriers through unique tracking numbers assigned to each shipment. These allow both the sender and recipient to monitor the shipment's progress, location, and estimated delivery time online or via carrier apps.

Benefits include faster product development, the ability to explore and resolve design issues early, and improved communication among teams.

The developing process in PCB involves preparing the board for etching by applying a photosensitive material and then exposing it to light through a mask, defining the circuit pattern. This step is crucial for accurate circuitry layout on the PCB.

In engineering, THT (Through-Hole Technology) refers to a traditional method of assembling electronic circuits by mounting components with leads on a PCB and soldering them through holes, providing strong mechanical bonds.

BGA is used for its ability to provide a large number of interconnections in a small space, improving performance and reducing size. The solder balls offer better joint reliability and heat conduction, suitable for high-performance and compact electronic devices.

BGA is used in PCBs to achieve higher density connections, allowing more pins in less space compared to traditional packaging. This is crucial for modern electronic devices that require compact size with high functionality.

BGA is important in PCB assembly for enabling high-density connections, reducing PCB size, and enhancing electrical performance. Its solder ball array allows for efficient manufacturing and reliable electrical connections, critical for modern, high-performance electronics.

High volume PCB assembly is crucial for meeting the demand of consumer electronics, reducing production costs, and achieving economies of scale. It enables widespread distribution of technology at lower prices.

Flexibility in design changes Faster turnaround time Reduced upfront costs Opportunity for thorough testing and quality control Ideal for prototyping and market testing

Stencil shape refers to the specific geometric or design cut-outs in a stencil that define where and how materials like solder paste will be applied to another surface.