Frequently Asked
Questions

A BGA chipset refers to a chipset packaged in a Ball Grid Array format. It is used in various electronic devices, such as computers and smartphones, for its efficient space utilization and reliable connections.

BGA assembly is the process of attaching Ball Grid Array (BGA) components to a printed circuit board (PCB) using surface mount technology (SMT) techniques. It involves applying solder paste, placing BGA components, and using reflow soldering to establish the connections.

In consigned assembly, the customer supplies the components, and the service provider assembles the PCB. In turnkey assembly, the service provider manages the entire process, from sourcing components to assembly, delivering a complete product without the customer needing to provide materials.

Turnkey PCB assembly is a service where a single vendor handles all aspects of the PCB project, including component procurement, PCB manufacturing, and assembly. This approach simplifies the process for customers, as they only need to provide design files.

When sourcing components, consider component quality, supplier reliability, cost, availability, and lead times. Also, evaluate potential supply chain risks and the need for alternative components to prevent production delays.

Component procurement is the process of acquiring electronic components and parts necessary for manufacturing products. It involves selecting suppliers, negotiating prices, and managing inventory to meet production requirements.

To avoid bad solder joints, ensure clean and well-prepared surfaces, use the correct solder and flux, apply appropriate heat, and adhere to optimal soldering times. Proper technique and equipment maintenance are also crucial.

The issue with solder wetting occurs when the solder fails to spread on the metal surface being soldered, leading to weak or unreliable joints. Poor wetting can result from oxidation, contamination, or inadequate flux.

DFM (Design for Manufacturing) ensures products are easy and cost-effective to manufacture. DFA (Design for Assembly) aims to simplify and reduce the assembly process's complexity and cost. Both principles aim to optimize the production process and product lifecycle.

Designing a PCB involves schematic capture, board layout, design verification using DRC and ERC, prototyping to test functionality, and adjusting the design based on prototype feedback before final production.