Frequently Asked
Questions

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

The 17 common steps include design, material selection, pattern transfer, etching, layer lamination, drilling, plating, solder mask application, silkscreen, surface finishing, testing, inspection, depaneling, packaging, and shipping. This comprehensive process ensures PCB reliability and performance.

Solder is typically made from a mixture of metals. Traditional solder contains lead (Pb) and tin (Sn), while lead-free solder, which is becoming standard, primarily consists of tin, with additives like copper, silver, and sometimes bismuth.

BGA stands for Ball Grid Array, a type of surface mount packaging used for integrated circuits. BGA packages use solder balls arranged in a grid on the bottom of the package for electrical and mechanical connection to the PCB.

A product development strategy is a roadmap that outlines how a new product will be developed, launched, and managed to meet business objectives. It includes market analysis, product positioning, development timelines, and go-to-market plans.

DFX intersects with Rapid Prototyping by applying principles of excellence in design to the prototyping phase, ensuring that prototypes are not only produced quickly but also accurately reflect manufacturability, assembly, and testing considerations.

Verifying a PCB layout involves using PCB design software's DRC (Design Rule Check) and ERC (Electrical Rule Check) features to ensure the design meets manufacturing and functionality standards.

EOL testing differs from other methods by being the conclusive assessment performed after all manufacturing processes are completed, focusing on verifying the final product's functionality and compliance with specifications, unlike specific component or assembly checks done earlier.

The PCB Assembly (PCBA) process includes applying solder paste, placing components, soldering, inspection and testing. This ensures that all components are correctly mounted and the PCB functions as intended.

Shipping methods for PCBs include standard postal services, express courier services (like FedEx, UPS, DHL), and freight services for larger shipments. The choice depends on the urgency, volume, and budget.