Frequently Asked
Questions

Materials used for fixture design include metals (aluminum, steel), plastics (ABS, Delrin), and composites, chosen for their durability, resistance, and application-specific properties.

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.

PFMEA, or Process Failure Mode and Effects Analysis, is a structured approach to identify, prioritize, and mitigate risks in a manufacturing process, aiming to improve quality and reliability by preventing process-related failures.

DFM (Design for Manufacturability) is a subset of DFX (Design for Excellence), focusing specifically on designing products in a way that simplifies manufacturing processes, reduces costs, and ensures quality. DFX encompasses a broader range of considerations, including manufacturability, assembly, testing, cost, and sustainability, aiming for overall excellence in product design and production.

Analyzing a PCB involves using EDA software to simulate electrical functionality, signal integrity, thermal management, and mechanical stability, identifying potential issues before manufacturing.

Design for Assembly (DFA) focuses on simplifying a product's assembly to reduce costs and time. Example: Using snap-fit components in a toy to minimize the use of screws and tools.

Design for Manufacturing and Assembly (DFMA) is an integrated approach combining DFM and DFA principles to simplify the manufacturing and assembly processes, thus reducing production costs and improving product quality and performance.

Common soldering problems include cold joints, overheated components, solder bridges (shorts), insufficient wetting, and excessive flux residue. These issues can compromise electrical connections and the reliability of the PCB.

Major soldering defects include cold joints, dry joints, solder bridges, tombstoning, solder balls, and voids, each affecting the functionality and reliability of the PCB.

A PCB solderability test evaluates a board's ability to be soldered to, ensuring that the solder properly wets and adheres to the component leads and pads. This test is crucial for assessing the quality of PCB materials and surface finishes.