Frequently Asked
Questions

SMT soldering is the process of joining SMT components to a PCB using solder paste that is reflowed under controlled heat, creating mechanical and electrical connections.

Hybrid assembly lines differ from traditional ones by integrating both automated machinery and manual labor, allowing for more versatile production processes that can adapt to complex or variable product designs, whereas traditional lines typically rely on either full automation or manual processes.

Hybrid assembly lines are used to balance the efficiency and consistency of automation with the adaptability and problem-solving capabilities of human workers, making them ideal for producing a wide range of products, including those requiring intricate assembly or quality checks.

Solder flux is a chemical cleaning agent applied before soldering to remove oxides from metal surfaces, promoting better wetting and flow of the solder, and preventing re-oxidation during the soldering process.

An in-circuit test (ICT) is a method of electrical testing that checks the components mounted on a PCB individually for shorts, opens.

Box build solutions are highly customizable to meet specific customer needs and product requirements. This flexibility allows for a wide range of product complexities and functionalities, from simple enclosures with a single PCB to complex systems with multiple integrated components and technologies.

PCB packaging is vital for protecting the board from physical damage, electrostatic discharge (ESD), and environmental factors like moisture. It also ensures compliance with shipping regulations and reflects the brand's quality commitment.

PCBs are shipped in protective packaging, including anti-static bags and cushioning materials, within sturdy boxes. This ensures protection against physical damage, electrostatic discharge, and moisture during transit.

Rapid prototyping is a broader concept that includes 3D printing among other techniques like CNC machining and injection molding for creating prototypes quickly.

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.