Frequently Asked
Questions

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.

Materials used for fixture design include metals (aluminum, steel), plastics (ABS, Delrin), and composites, chosen for their durability, resistance, and application-specific properties.

PCB reverse engineering is the process of analyzing a physical PCB to recreate its design. Preventing it involves using encryption, proprietary components, and complex circuit designs.

Tracing a PCB circuit involves carefully examining and mapping out the connections and components on a board to understand its electrical flow and functionality.

Rapid prototyping is a broader concept that includes 3D printing among other techniques like CNC machining and injection molding for creating prototypes quickly.

An electrical function test evaluates an electronic assembly, such as a PCB, to ensure it performs its intended electrical functions correctly. This involves applying power to the assembly and simulating operational conditions to verify functionality and compliance with design specifications.

PCB functional testing services are offered by EMS providers to test assembled PCBs for proper functionality. These services use specialized equipment and test setups to simulate operational conditions and verify product performance against specified criteria.

Choosing the right stencil thickness depends on: The size and pitch of components: Finer pitches require thinner stencils. The volume of solder paste needed: Larger pads may require thicker stencils.

Stencils are used in PCB assembly to ensure accurate, repeatable, and efficient application of solder paste, crucial for reliable soldering in surface mount technology processes.

To use a PCB stencil: Secure the stencil over the PCB. Apply solder paste over the stencil. Use a squeegee to spread the paste, filling the apertures. Carefully lift the stencil, leaving solder paste on the PCB pads. Proceed with component placement and reflow soldering.