Frequently Asked
Questions

Manual Soldering: Using a soldering iron for individual components. Reflow Soldering: Applying solder paste and heating the entire board to melt the paste, used for SMT components. Wave Soldering: Passing the PCB over a wave of molten solder, primarily for through-hole components.

The product life cycle of an electronic product involves initial research and development, followed by introduction to the market, rapid growth influenced by technology advancements, maturity as market saturation approaches, and eventually, decline as newer technologies emerge.

• Analyzing your target market and brand identity. • Considering product protection and functionality. • Evaluating materials for sustainability and cost-effectiveness. • Aligning design elements with your marketing strategy. • Testing designs with your target audience.

Component design in engineering involves creating and specifying the physical and functional characteristics of parts used in a larger system. This process includes drafting detailed designs, selecting appropriate materials, and defining performance requirements to ensure reliability and functionality.

BGA reballing is the process of removing old solder balls from a BGA component and replacing them with new ones. This repair technique is used to fix defective BGA solder joints or to reattach a BGA component to a PCB.

Many PCB manufacturers specialize in low volume production, catering to custom projects, prototypes, and small-scale production needs. These providers offer flexibility and quick turnaround times.

Soldering defects are imperfections in solder joints that can lead to failures in electrical circuits. They include cold solder joints, solder bridges, insufficient or excessive solder, tombstoning, and voids.

Single-sided Double-sided Multilayer Flexible Rigid Rigid-Flex

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

Analyzing a PCB involves using EDA software to simulate electrical functionality, signal integrity, thermal management, and mechanical stability, identifying potential issues before manufacturing.