Häufig gefragt
Fragen

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

PFMEA, or Process Failure Mode and Effects Analysis, is a structured approach to identify, prioritize, and mitigate risks in a manufacturing process, aiming to improve quality and reliability by preventing process-related failures.

Conducting ESS leads to early detection of issues, enhanced product durability, reduced post-launch failures, and increased customer trust.

Design for Manufacturing and Assembly (DFMA) is an integrated approach combining DFM and DFA principles to simplify the manufacturing and assembly processes, thus reducing production costs and improving product quality and performance.

Design for Assembly (DFA) focuses on simplifying a product's assembly to reduce costs and time. Example: Using snap-fit components in a toy to minimize the use of screws and tools.

An in-circuit test (ICT) is a method of electrical testing that checks the components mounted on a PCB individually for shorts, opens.

Major soldering defects include cold joints, dry joints, solder bridges, tombstoning, solder balls, and voids, each affecting the functionality and reliability of the PCB.

A PCB solderability test evaluates a board's ability to be soldered to, ensuring that the solder properly wets and adheres to the component leads and pads. This test is crucial for assessing the quality of PCB materials and surface finishes.

Solder flux is a chemical cleaning agent applied before soldering to remove oxides from metal surfaces, promoting better wetting and flow of the solder, and preventing re-oxidation during the soldering process.

Box build solutions are highly customizable to meet specific customer needs and product requirements. This flexibility allows for a wide range of product complexities and functionalities, from simple enclosures with a single PCB to complex systems with multiple integrated components and technologies.