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Customs clearance and duties involve the process and fees associated with the importation of goods across international borders. Duties are taxes imposed on imports, and clearance involves adhering to all legal and regulatory requirements set by the importing country.

BGA is important in PCB assembly for enabling high-density connections, reducing PCB size, and enhancing electrical performance. Its solder ball array allows for efficient manufacturing and reliable electrical connections, critical for modern, high-performance electronics.

Environmental stress refers to extreme conditions a product might encounter during its lifecycle, including temperature variations, humidity, vibration, and shock. These conditions can reveal hidden weaknesses in the product's design or manufacturing.

The principles of Design for Excellence (DFX) focus on optimizing all facets of the product lifecycle for performance, cost, quality, time to market, customer satisfaction, and environmental impact. This includes design for manufacturability, assembly, testing, sustainability, and more, aiming for excellence in every aspect of the product's design and production.

High volume PCB assembly is crucial for meeting the demand of consumer electronics, reducing production costs, and achieving economies of scale. It enables widespread distribution of technology at lower prices.

Functional testing is conducted by applying specific inputs to the PCB and measuring the outputs to compare against expected results. Test equipment may include signal generators, power supplies, and measurement devices, configured according to the PCB's operational specifications.

Desiccants in PCB packaging absorb moisture, preventing condensation and corrosion on the PCB during shipping and storage, thus preserving its functionality and longevity

PFMEA (Process FMEA) focuses specifically on identifying and reducing risks in manufacturing processes, while FMEA is a broader term that can refer to Design FMEA (DFMEA), Process FMEA (PFMEA), or System FMEA (SFMEA), each targeting different aspects of product and process reliability.

Varies by manufacturer and application; standard sizes can go up to 18x24 inches, with most fitting within smaller dimensions for standard processes.

To avoid bad solder joints, ensure clean and well-prepared surfaces, use the correct solder and flux, apply appropriate heat, and adhere to optimal soldering times. Proper technique and equipment maintenance are also crucial.