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In consigned assembly, the customer supplies the components, and the service provider assembles the PCB. In turnkey assembly, the service provider manages the entire process, from sourcing components to assembly, delivering a complete product without the customer needing to provide materials.

BGA assembly is the process of attaching Ball Grid Array (BGA) components to a printed circuit board (PCB) using surface mount technology (SMT) techniques. It involves applying solder paste, placing BGA components, and using reflow soldering to establish the connections.

A BGA chipset refers to a chipset packaged in a Ball Grid Array format. It is used in various electronic devices, such as computers and smartphones, for its efficient space utilization and reliable connections.

Combines automation's speed with human flexibility. Improves efficiency and quality control. Adapts easily to production changes and complex designs.

Functional testing is crucial in PCB assembly because it: Ensures the assembled PCB meets the design requirements. Identifies manufacturing defects or component failures. Guarantees product reliability and quality before market release.

MDA testing is crucial for early detection of manufacturing defects, reducing scrap rates, improving yield, and ensuring product reliability before further investment in assembly.

Technological advancements have significantly enhanced EOL testing by improving test accuracy, speed, and efficiency. Automated test equipment and sophisticated diagnostics now enable more comprehensive and faster assessments, leading to improved product quality and reduced time to market.

Technologies in rapid prototyping include 3D printing, selective laser sintering (SLS), fused deposition modeling (FDM), and stereolithography (SLA).

PCB fabrication involves transferring the circuit design onto a substrate, etching away excess material, drilling holes for components, and applying a protective solder mask. This process prepares the PCB for component assembly.

The main types of FMEAs are Design FMEA (DFMEA), Process FMEA (PFMEA), and System FMEA (SFMEA), each analyzing risks at different stages of product development and manufacturing to enhance reliability and safety.