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DFM (Design for Manufacturing) ensures products are easy and cost-effective to manufacture. DFA (Design for Assembly) aims to simplify and reduce the assembly process's complexity and cost. Both principles aim to optimize the production process and product lifecycle.

MDA focuses on identifying manufacturing defects (shorts, opens, missing components) early in the production process, while ICT (In-Circuit Testing) provides a more comprehensive check, including component functionality and specific electrical parameters.

The product life cycle refers to the stages a product goes through from conception to discontinuation. Its management, or PLM, involves overseeing all aspects of a product's development and market presence, optimizing performance, and maximizing profitability at each stage.

High Volume: Ideal for mass-market products, offering cost benefits but requires significant design and testing investment. Low Volume: Suited for prototypes and small runs, providing flexibility and easy design adjustments at a higher cost per unit.

FR-4 is the most commonly used low-cost PCB material, known for its good electrical properties, durability, and flame resistance. Other affordable options include CEM-1 and phenolic paper laminate for less demanding applications.

An example of PFMEA in manufacturing could involve the assembly line for electronic devices, where PFMEA helps identify potential issues like incorrect component placement or soldering defects, allowing for preventive measures to be implemented.

EOL testing is crucial for ensuring product quality and reliability, identifying and rectifying defects before products reach customers, thereby reducing returns and enhancing customer satisfaction.

An example of a box build could be the assembly of a consumer electronics product, like a computer, where various components such as the motherboard, power supply, and hard drives are installed into the computer case, along with wiring and cable management.

Typical PCB packaging materials include anti-static bags to prevent ESD damage, bubble wrap or foam for cushioning, corrugated cardboard boxes for external protection, desiccants to absorb moisture, and sealing tape and labels.

Box build assembly, also known as systems integration, is the comprehensive process of assembling complex electronic and mechanical components into a final product enclosure. It goes beyond PCB assembly to include the integration of all components into a complete system or sub-system.