Frequently Asked
Questions

An example of a component in engineering is a microcontroller used in electronic devices. Microcontrollers serve as the "brain" of devices, executing software instructions to perform tasks and control other components within the system.

DFX intersects with Rapid Prototyping by applying principles of excellence in design to the prototyping phase, ensuring that prototypes are not only produced quickly but also accurately reflect manufacturability, assembly, and testing considerations.

Verifying a PCB layout involves using PCB design software's DRC (Design Rule Check) and ERC (Electrical Rule Check) features to ensure the design meets manufacturing and functionality standards.

Quick turn PCB assembly refers to the rapid production of PCBs, focusing on speed and efficiency. This service is designed for projects requiring fast turnaround times, often to meet tight deadlines or for prototype testing.

There are mainly two types of turnkey PCB assembly: Full Turnkey: The service provider handles all aspects, including PCB manufacturing, component sourcing, assembly, and testing. Partial Turnkey: The customer may supply some materials or components, and the service provider completes the rest of the manufacturing process.

Full Turnkey Pros: Simplifies customer involvement, faster turnaround. Cons: Higher costs, less control over components. Consignment Pros: Greater control over components, potential cost savings. Cons: More customer effort, risk of delays.

THT stands for Through-Hole Technology in electronics, a method of PCB assembly where components have leads that are inserted through holes drilled in the board and soldered to pads on the opposite side.

The through-hole technology process involves drilling holes into a PCB, inserting the leads of components through these holes, and then soldering the leads to the board. This process is often used for components that require stronger physical connections.

The usefulness of THT vs. SMT production lines depends on the application: THT is more useful for high-power or high-stress applications where strong mechanical bonds are crucial. SMT is preferred for modern, compact devices requiring high-density component placement and faster production times. SMT allows for smaller PCB designs and can accommodate both sides of the board, making it more suitable for mass production of electronic devices with space constraints.

BGA stands for Ball Grid Array, a type of surface mount packaging used for integrated circuits. BGA packages use solder balls arranged in a grid on the bottom of the package for electrical and mechanical connection to the PCB.