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PFMEA, or Process Failure Mode and Effects Analysis, is a structured approach to identify, prioritize, and mitigate risks in a manufacturing process, aiming to improve quality and reliability by preventing process-related failures.

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.

Materials used for fixture design include metals (aluminum, steel), plastics (ABS, Delrin), and composites, chosen for their durability, resistance, and application-specific properties.

PCB reverse engineering is the process of analyzing a physical PCB to recreate its design. Preventing it involves using encryption, proprietary components, and complex circuit designs.

Tracing a PCB circuit involves carefully examining and mapping out the connections and components on a board to understand its electrical flow and functionality.

Rapid prototyping is a broader concept that includes 3D printing among other techniques like CNC machining and injection molding for creating prototypes quickly.

The Bill of Materials (BOM) in box build assembly is a comprehensive list detailing every part and component required for the assembly, including quantities, specifications, and supplier information. It serves as a critical resource for planning, purchasing, and assembling the final product.

If a PCB fails functional testing: The failure is analyzed to determine the cause (component, assembly process, design issue). The PCB may undergo rework or repair to correct the identified issue. After repairs, the PCB is retested to ensure it now passes functional testing, verifying its readiness for final assembly.

PCB functional testing services are offered by EMS providers to test assembled PCBs for proper functionality. These services use specialized equipment and test setups to simulate operational conditions and verify product performance against specified criteria.

Choosing the right stencil thickness depends on: The size and pitch of components: Finer pitches require thinner stencils. The volume of solder paste needed: Larger pads may require thicker stencils.