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PCB packaging is vital for protecting the board from physical damage, electrostatic discharge (ESD), and environmental factors like moisture. It also ensures compliance with shipping regulations and reflects the brand's quality commitment.

PCBs are shipped in protective packaging, including anti-static bags and cushioning materials, within sturdy boxes. This ensures protection against physical damage, electrostatic discharge, and moisture during transit.

Rapid prototyping is a broader concept that includes 3D printing among other techniques like CNC machining and injection molding for creating prototypes quickly.

The three types of FMEA are Design FMEA (DFMEA), which focuses on potential failures in product design; Process FMEA (PFMEA), which identifies potential failures in manufacturing processes; and System FMEA (SFMEA), which analyzes failures at the system or subsystem level.

PFMEA, or Process Failure Mode and Effects Analysis, is a structured approach to identify, prioritize, and mitigate risks in a manufacturing process, aiming to improve quality and reliability by preventing process-related failures.

Design for Manufacturing and Assembly (DFMA) is an integrated approach combining DFM and DFA principles to simplify the manufacturing and assembly processes, thus reducing production costs and improving product quality and performance.

The importance of design for manufacturing lies in its potential to significantly reduce production costs, improve product quality, speed up time to market, and ensure product reliability. DFM facilitates efficient manufacturing processes and enhances product lifecycle management.

Designing a test involves first identifying its objectives and requirements, then selecting suitable methods and tools. It requires creating detailed test cases and procedures to cover all functionalities and failure modes, and integrating testing checkpoints into the product design for efficient access and evaluation.

Cold/Dry Joints: Reheat the joint with proper solder and flux. Solder Bridges: Remove excess solder with desoldering braid. Solder Balls: Clean the area and reapply solder with correct temperature. Tombstoning: Adjust component placement and reflow solder. Voids: Apply additional flux and reheat to allow solder to fill gaps.

Turnkey assembly is a manufacturing service where the provider oversees the entire assembly process of a product, from sourcing materials and components to the final assembly, ensuring the product is ready for use or sale immediately upon delivery.