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Functional testing is conducted by applying specific inputs to the PCB and measuring the outputs to compare against expected results. Test equipment may include signal generators, power supplies, and measurement devices, configured according to the PCB's operational specifications.

"Print" generally refers to transferring ink or toner onto paper or other substrates, while "stencil" involves applying a material through a template to create a design or pattern on a surface.

Stencil shape refers to the specific geometric or design cut-outs in a stencil that define where and how materials like solder paste will be applied to another surface.

Inflexibility: Difficulties in adapting to market changes or customizing products. Upfront Investment: High initial costs for setting up production lines and purchasing materials. Inventory Risk: Potential for excess inventory if demand decreases or shifts.

Flexibility in design changes Faster turnaround time Reduced upfront costs Opportunity for thorough testing and quality control Ideal for prototyping and market testing

Low volume refers to the production of a limited number of units, allowing for greater flexibility, customization, and faster response to market changes compared to high-volume production.

The smallest PCB can be as tiny as a few millimeters across, designed for highly compact devices or applications where space is at a premium. The exact size depends on the application's requirements and the capabilities of the manufacturer.

High volume PCB assembly is crucial for meeting the demand of consumer electronics, reducing production costs, and achieving economies of scale. It enables widespread distribution of technology at lower prices.

Assembly line design refers to the strategic layout and organization of tools, equipment, and workstations in a production line to optimize the assembly process. It focuses on efficiency, minimizing production time, and reducing costs while ensuring product quality.

BGA is important in PCB assembly for enabling high-density connections, reducing PCB size, and enhancing electrical performance. Its solder ball array allows for efficient manufacturing and reliable electrical connections, critical for modern, high-performance electronics.