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Rapid prototyping means quickly creating physical models using CAD designs to test form, fit, and functionality during the product development phase.

Software like Altium Designer, Cadence, and Eagle are highly regarded for PCB reverse engineering, offering powerful tools for circuit analysis and schematic reproduction.

The process involves deconstructing a product or system to understand its design and functionality, often using CAD modelling, to create a replica or improve upon the original design.

PCB assembly steps include solder paste printing, component placement, soldering (reflow or wave), inspection (AOI, X-ray, manual), and testing (functional, in-circuit). These ensure the correct assembly and functionality of PCBs. What is the production process of PCBs? The PCB production process encompasses design, material selection, patterning, etching, layer stacking, drilling, plating, solder mask application, and finishing. This multi-step process ensures high-quality and functional circuit boards.

PCB fabrication involves transferring the circuit design onto a substrate, etching away excess material, drilling holes for components, and applying a protective solder mask. This process prepares the PCB for component assembly.

Tooling and fixture design involves creating custom tools and supports to hold, handle, or guide components during manufacturing processes, ensuring precision, efficiency, and safety. It's critical for repetitive and high-accuracy operations.

An assembly fixture is a specialized tool used to hold components in precise alignment during the assembly process. It ensures components are accurately positioned for soldering or other joining methods.

The benefits of PLM include improved product quality, faster time to market, enhanced collaboration, cost reductions in design and manufacturing, efficient regulatory compliance, and better management of product data throughout its life cycle.

Designing a PCB involves schematic capture, board layout, design verification using DRC and ERC, prototyping to test functionality, and adjusting the design based on prototype feedback before final production.

The issue with solder wetting occurs when the solder fails to spread on the metal surface being soldered, leading to weak or unreliable joints. Poor wetting can result from oxidation, contamination, or inadequate flux.